Saru-Ishikawa solder paste is a unique blend of low oxides, high purity solder powder with various paste flux formulation. Our portfolio of solder paste material addresses a variety of manufacturing requirement and offer performance charactersitcs unmatched by any other material supplier. Whether your surface mount assembly requires no clean, RMA (Rosin Mildly Activated) or water soluble type solder paste,Saru-Ishikawa provides you with the right solder paste to achieve high productivity and reduce production cost
 
 S.No
Solder
paste Type
Solder
paste Type
Description
Alloy Type
Flux
Type
Flux Classif
IPC ( J-STD-004) 
Halide
Content (%)
Powder
Size
Flux
Content % 
Solidus
Temp
(°C)
Liquidus
Temp
(°C)
Shelf
Life
Paste Properties
 
  No
Clean
Solder
Paste
BH63K878DH BH63-Sn63-Pb37 878 ROLO 0.12-0.14 K-38-25
µ m
D-10%  183 183 6
months 
Halide free
It’s a pin-testable  solder paste
Excellent  humidity resistance
Broad process window both for reflow & printing
It meets J-STD-004/005  requirements & complies with Bellcore specifications.
 
BH62K878DH  BH62-Sn62-Pb36-AG2  878 ROLO 0.12 K-38-25
µ m
D-10%  179 184 6
months 
 
B184K878DH  B184-Sn62-AG-0.4-PB-Rem 878 ROLO 0.12 K-38-25
µ m
D-10%  179 184 6
months 
Water
soluble
Solder
Paste 
BH63JWS16E BH63-Sn63-Pb37 WS16 ORH1 0.12

J-45-25

µ m

E-10.5%  183 183 6
months 
High  performance
Water washable solder paste .
Residues are readily removed with
De Ionized water , without the need
for a saponifier .

Can leave it open to the atmosphere
for a long time without any effect on
the printing definition.

Designed for  surface Mount & medical
electronics assembly application .

 

RMA&
RA
Solder
Paste 
BH63K7030C BH63-Sn63-Pb37 7030 RMA 0.12 K-38-25
µ m
C-9.5%  183 183 6
months 
High  perfMeets/exceeds
J-STD-004/J-STD-005 standardisationormance
 
BH62K7030C BH62-Sn62-Pb36-AG2  7030 RMA  0.12 K-38-25
µ m
C-9.5%  179 184 6
months 
 
Characterstics
High Speed printing
Reflow with or without nitrogen
Excellent wettability
Stencil life > 12 hours
Tact time > 24 hours
Low void
Pin probe testable residue/td>
 
150-75μm   -100/200 1
75-45µ m  -200/+325 2
J
45-25µ m  -325/+500 3
K
38-25µ m  -400/+500  
P
38-20µ m  -400/+635 4
N
32-15µ m -400  
M
25-10µ m -500  
N
25-15µ m -500 5
A
15-5µ m -635 6
 
 
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