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Saru -Ishikawa lead free solder paste is available in a variety of chemistries , alloys, powder mesh sizes & packaging .
With out constant R & D we have developed a new technology - CC Mechanism ( Cyclic catching Mechanism : CCM )
This has helped us improve some of the characteristics listed below |
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Reduction in deterioration of paste as time passes |
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Wettability |
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Reduced Voids |
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Electric Reliability |
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| Ishikawa |
Flux Percentage |
| C |
9.50% |
| D |
10% |
| E |
10.50% |
| F |
11% |
| G |
12% |
| J |
13% |
| K |
14% |
| L |
14.50% |
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| Solder Powder Denomination |
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| Particle Size |
Mesh |
IPC Type |
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150-75µm |
-100/200 |
1 |
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75-45µ m |
-200/+325 |
2 |
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55µ m |
-270/+400 |
N.A. |
| J |
45-25µ m |
-325/+500 |
3 |
| K |
38-25µ m |
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| P |
38-20µ m |
-400/+635 |
4 |
| N |
32-15µ m |
-400 |
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| M |
25-10µ m |
-500 |
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| N |
25-15µ m |
-500 |
5 |
| A |
15-5µ m |
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6 |
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| Paste Packing Option |
| Jar |
500gm / 1 kg |
| Syringe |
10cc/30cc/500gm/1000gm |
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1 |
J3, R4-8900-K-E/F |
J3-Sn-3.0Ag-0.5Cu |
8900 |
NC |
0.01 |
K-38-25µm |
E-10.5%, F-11% |
217 |
220 |
stable viscosity ,void prevention and wettability |
3 months |
For application in all industries (Energy meter,consumer electronics,mobile ) |
| R4-Sn-0.7Cu-0.3Ag |
8900 |
NC |
0.01 |
K-38-25µm |
E-10.5%, F-11% |
217 |
226 |
stable viscosity ,void prevention and wettability |
3 months |
For application in all industries (Energy meter,consumer electronics,mobile ) |
2 |
J3-8600-KF |
J3-Sn-3.0Ag-0.5Cu |
8600 |
NC |
0.01 |
K-38-25µm |
F-11% |
217 |
220 |
No slump, No solder Ball, Fine Pitch Application |
3 months |
High Reliability |
3 |
J3-8800-K-E/F |
J3-Sn-3.0Ag-0.5Cu |
8800 |
NC |
0.01 |
K-38-25µm |
E-10.5%, F-11% |
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220 |
for high temperature heating |
3 months |
they are promoting for quanta- IBM,DELL,HP specilize for mother board) |
4 |
J3-8840-K-G |
J3-Sn-3.0Ag-0.5Cu |
8840 |
NC |
0.01 |
K-38-25µm |
G-12% |
217 |
220 |
improved wetting,no solder ball ,used in high density pcb |
3 months |
for mobile,digital camera,connectors |
5 |
J3-8843-K-G |
J3-Sn-3.0Ag-0.5Cu |
8843 |
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0.01 |
K-38-25µm |
G-12% |
217 |
220 |
Good wettability & Antioxidation effect of Flux |
3 months |
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6 |
J3-8850-K/UG |
J3-Sn-3.0Ag-0.5Cu |
8850 |
NC |
0.01 |
K-38-20µm |
G-12% |
217 |
220 |
Anti tombstonning , Wide process window |
6month |
For Consumer Electronics , Medium Reliability Industries , Motherboards |
7 |
J3-8752-K-E/F |
J3-Sn-3.0Ag-0.5Cu |
8752 |
NC |
0.01 |
K-38-25µm |
E-10.5%, F-11% |
217 |
220 |
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3 months |
design paste for low end pcb,generally china's and tiwan's mobile |
8 |
J3-9001-K-E/F |
J3-Sn-3.0Ag-0.5Cu |
9001 |
NC |
0.05 |
K-38-25µm |
E-10.5%, F-11% |
217 |
220 |
flux resudce can be removed/cleaned by DEIONIZED water |
3 months |
use in digital camera, mobile camera, laptop camera |
9 |
Y7-8571-K-E/F |
Sn-3.5Ag-8.0In-0.5Bi |
8571 |
NC |
0.1 |
K-38-25µm |
E-10.5%, F-11% |
195 |
208 |
paste designed for low melting components,due to presense of indium- price is high |
3 months |
use in digital camera,mobile |
10 |
Z2-7920-K-E/F |
Sn-8.0Zn-3.0Bi |
7920 |
NC |
0.02 |
K-38-25µm |
E-10.5%, F-11% |
187 |
197 |
paste design for low melting components ,due to presense of zinc- price is low |
3 months |
use in digital camera,mobile |
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Evasol lead free solder paste with halide content(Syringe packing,40cc and 100cc) |
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11 |
J3-3229-JK |
J3-Sn-3.0Ag-0.5Cu |
3229 |
NC |
0.08 |
J-45-25µm |
K-14% |
217 |
220 |
soldering done through lazer heating |
3 months |
for automobile industries-tyota(corporate approval),nisan,honda,penasonic |
12 |
J3-3230-KK |
J3-Sn-3.0Ag-0.5Cu |
3230 |
NC |
0.09 |
K-38-25µm |
K-14% |
217 |
220 |
soldering done through lazer heating |
3 months |
for automobile industries-tyota(corporate approval),nisan,honda,penasonic |
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