| |
|
JIS |
MIL |
IPC
( J-STD-004) |
ISO |
|
|
|
|
|
|
|
 |
J3-MKT-3 |
A |
RMA |
ROL1 |
1.1.2.X |
Sn-3.0Ag-0.5Cu |
0.10% |
|
2.7%-3.3% |
217°C |
220°C |
 |
good wettability |
|
 |
|
low flux spattering |
|
|
|
low fumes at soldering. |
|
|
J3-MTS-3 |
A |
RMA |
ROL1 |
1.1.2.X |
Sn-3.0Ag-0.5Cu |
0.09% |
|
2.7% - 3.3% |
217°C |
220°C |
|
Excellent Solderbility by Improving Intial Wettability |
|
 |
J3-ATS-3 |
A |
RMA |
ROM1 |
1.1.2.Y |
Sn-3.0Ag-0.5Cu |
0.41% |
|
2.7%-3.3% |
217°C |
220°C |
|
Excellent Solderbility by Improving Intial Wettability |
|
 |
J3 MRK-3 |
A |
RMA |
ROL1 |
1.1.2.X |
Sn:Rem Ag:3 Cu:0.5 |
0.10% |
|
2.7%-3.3% |
217°C |
220°C |
|
Used as an active agent which
doesn't gasify easily |
|
|
|
Rosin with high melt viscosity
reduces spattering |
|
| Y5-MRK-3 |
Sn:Rem Ag:3.5 In:3 Bi:0.5 |
|
2.7%-3.3% |
193°C |
216°C |
| Y7-MRK-3 |
Sn:Rem Ag:3.5 In:8.0 Bi:0.5 |
0.10% |
2.7%-3.3% |
195°C |
208°C |
 |
J3-MAP-3 |
A |
RMA |
ROL1 |
1.1.2.X |
Sn-3.0Ag-0.5Cu |
0.11% |
|
2.7%-3.3% |
217°C |
220°C |
|
Combination of MTS,MRK and ARK |
|
|
|
ATS flux has high wettability and low scattering properties |
|
| R4-MAP-3 |
Sn-0.7Cu-0.3Ag |
0.11% |
|
2.7%-3.3% |
217°C |
226°C |
 |
J3 ARK-3 |
A |
RMA |
ROM1 |
1.1.2.Y |
Sn-3.0Ag-0.5Cu |
0.37% |
|
2.7%-3.3% |
217oC |
220°C |
|
Reduces copper erosion thus depressing Copper diffusion into solder. |
|
|
|
Suitable for Ni plated substrate stainless,etc. |
|
 |
J3-AAP-3 |
A |
RMA |
ROM1 |
1.1.2.Y |
Sn-3.0Ag-0.5Cu |
0.40% |
|
2.7%-3.3% |
217°C |
220°C |
|
Reduces copper erosion thus depressing Copper diffusion into solder. |
|
|
|
Suitable for Ni plated substrate stainless,etc. |
|
| R4-AAP-3 |
Sn-0.7Cu-0.3Ag |
0.40% |
|
2.7%-3.3% |
217°C |
26°C |
 |
J3-ESM-3 |
|
|
|
|
|
0.16% |
0.33% |
2.7%-3.3% |
217°C |
220°C |
|
For Stainless Soldering ,brass soldering and nickle oldering |
|
|
|
Presence of Fluorine in Flux
provides difficult metal to solder . |
|
 |
J3-ESK-3
(old) |
|
|
|
|
|
0.33% |
0.33% |
2.7%-3.3% |
217°C |
220°C |
|
Provides excellent welting &
soldering with Stainless Steel, Nickel, |
|
|
| |
Pure brass , Yellow brass & oxidised copper. |
|
 |
J3-ABR-3 |
|
|
|
|
Sn-0.7Cu-0.3Ag |
0.40% |
|
2.7%-3.3% |
217°C |
220°C |
|
Suitable For Brass Soldering |
|
 |
J3-DSG-3 |
|
|
|
|
|
0.08% |
|
2.7%-3.3% |
217°C |
220°C |
|
Provides Stable Flux Residue. |
|
|
|
Prevents formation of Flux Residue, Crack &heat Slump |
|
|
|
Can be used in automobile industries and heavy equipment industries. |
|
MIL-
RMA |
|
|
|
Sn-3.0Ag-0.5Cu |
 |
J3-DTR-4 |
AA |
RMA |
REL1 |
1.2.2.X |
Sn-3.0Ag-0.5Cu |
0.1% |
|
3.7%-4.3% |
217°C |
220°C |
|
Soldering with light beam heating device or through lazer heating |
|
 |
J3-DTS-4 |
A |
RA |
REL1 |
1.1.2.Y |
Sn-3.0Ag-0.5Cu |
0.4% |
|
3.7%-4.3% |
217°C |
220°C |
|
For Non contact Soldering or point soldering with softbeam or laser |
|
 |
R33-STE-3
(old) |
|
|
|
|
Sn-0.3Ag- 3Cu |
0.22% |
0.33% |
|
217°C |
312°C |
|
It reduces copper erosion thus depressing Copper diffusion into solder. |
|
|
|
It is suitable for Ni plated substrate stainless,etc. |
|
 |
J3-SGR-3
(Rein Flux Cored) (Rolo) |
|
|
|
|
Sn-3.0Ag-0.5Cu |
0.03% |
|
2.7%-3.3% |
217°C |
220°C |
|
 |
J3-WSS-3
C601 Series
(Water Soluble Flux) |
|
|
|
|
Sn-3.0Ag-0.5Cu |
0 |
|
2.7%-3.3% |
217°C |
220°C |
|
Flux residue can be removed with water |
|
|
|
Good wettability |
|
 |
J3-HFS-4 |
A |
RMA |
ROL1 |
1.1.2.X |
Sn-3.0Ag-0.5Cu |
|
|
3.7%-4.3% |
217°C |
220°C |
|
High heat resistance compared with HFC |
|
|
|
No icicle during soldering. |
|
 |
J3-HFC-3 |
AA |
RMA |
ROLO |
1.1.3.W |
Sn-3.0Ag-0.5Cu |
|
|
2.7%-3.3% |
217°C |
220°C |
|
Good wettability on brass and nickle plated . |
|
